Conquer Automotive Application introduction

FCI – Unveils Minitek PWR 3.0 Minitek Pw 4.2 Wire-to-Board and Wire-to-Wire Connectors

FCI, a leading supplier of connectors and interconnect systems, is proud to announce the launch of its cost-effective Minitek...

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Molex – Debuts Impel High-Speed, High-Performance Backplane Connector System

New system combines industry-leading signal integrity and density with a scalable price and performance path for future data-rate enhancements

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AVX – Adds New High Temperature Ceramic to its APS Range for COTS Applications

AVX’s APS series of multilayer ceramic capacitors offers the customer a high reliability solution with an ultralow failure rate...

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Nordic Semiconductor launches ultra-thin Bluetooth Smart solution for space-constrained smartcards and wearable applications.

The Thin WL-CSP nRF51822 is designed to address the needs of the fast-growing Bluetooth® connected payment and subscription smartcard...

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AVX – Extends the Capacitance Range & Voltage Ratings for its X7R MLCCs

AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has extended the capacitance range and voltage ratings...

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Maxwell Technologies Sets a New Standard for Energy, Power and Ruggedness with the Latest Addition to its Market Leading Family of Large Ultracapacitor Cells

Maxwell Technologies, a leading developer and manufacturer of Ultracapacitors announces the latest addition of ultracapacitor cell. The new 2.85-volt, 3400-farad...

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AVX – Introduces New AT Series High Temperature MLCC Chips Rated at 250°C

AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has introduced a new high temperature chip capacitor...

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Murata – Ultra compact light and low power SMD piezoelectric sounder PKMCS0909E4000

Murata announced they have commenced mass production of, what they believe, to be the smallest and lightest surface mount...