Epson presents its new S1V3G340 ASIC and S1C31D50 MCU + evaluation board with improved software
Epson’s hardware/software solutions for voice/audio playback of self-configured sentences in 12 languages, without the need for expensive trips to...
Epson’s hardware/software solutions for voice/audio playback of self-configured sentences in 12 languages, without the need for expensive trips to...
RealSense™ D455f: Longest Range Depth Camera with IR Pass Vision & IMU The Intel® RealSense™ Depth Camera D455f...
The ultra-small Type 2AB UWB & Bluetooth ® Low Energy combo module is now available. With its compact design...
The Murata Type 2EA is a Wi-Fi 6E plus Bluetooth BR/EDR/LE 5.3 module based on the new Infineon CYW55573...
The AIROC™ CYW5557x Family is a Wi-Fi 6 and Wi-Fi 6E plus Bluetooth 5.3 combo chip family, which offers...
The Infineon DEV_KIT_NGC1081 is a Development Kit for engineers who want to use the NFC tag-side controller NGC1081. The...
The Panasonic PAN1783 is a Bluetooth Low Energy 5.3 module, which is based on the nRF5340 from Nordic Semiconductor,...
The PAN9019 is a dual band 2.4 GHz and 5 GHz WiFi 6 (IEEE 802.11 a/b/g/n/ac/ax) and Bluetooth BDR/EDR/LE...
PAN1780 Wirepas Mesh Demo Kit Panasonic has announced the official NPI of the PAN1780 Wirepas Mesh Demo Kit. It...
TDK Corporation (TSE:6762) presents the new EPCOS B43657* aluminum electrolytic capacitor series with snap-in terminals. The capacitors achieve a...
The new SuperCapacitor modules exhibit very high capacitance, very low ESR, high efficiency, high power density, and excellent pulse...
