Diodes – Logic-Smallest Package to Reduce Footprint

DFN0808 Package: One of the world’s smallest packages. 0.8 mm X 0.8 mm X 0.35 mm. Diamond pin arrangement

Worlds Smallest Footprint

  • Saves Space
  • Point of use application saves routing
  • Package is smaller than all DFN parts

Extremely Low Profile

  • 0.35 mm package height

Wide Range of Products

  • 74AUP1Gxx
  • 14 functions
  • 0.8 to 3.6 V


  • 13 functions
  • 1.65 to 5.5 V
  • Higher performance

The Diodes Advantage:

  • Extremely Small Package: At 0.8 mm X 0.8 mm the foot print is 35% smaller than other popular alternatives. With board space being at a premium in smart phones and tablets, these packages offer an ideal space saving solution.
  • Uses standard 0.5 mm pitch solder guidelines: The diamond arrangement of the pins give a 0.5mm spacing equivalent which may eliminate the need for a stepped solder stencil.
  • Power and Performance Options: The 74AUP1G products operate at very low power with a Vcc range of 0.8 to 3.6V. If more performance or a higher voltage operation is needed, the 74LVC1G family operates from 1.65 to 5.5V.
See also

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