Diodes – Logic-Smallest Package to Reduce Footprint
DFN0808 Package: One of the world’s smallest packages. 0.8 mm X 0.8 mm X 0.35 mm. Diamond pin arrangement
Worlds Smallest Footprint
- Saves Space
- Point of use application saves routing
- Package is smaller than all DFN parts
Extremely Low Profile
- 0.35 mm package height
Wide Range of Products
- 14 functions
- 0.8 to 3.6 V
- 13 functions
- 1.65 to 5.5 V
- Higher performance
The Diodes Advantage:
- Extremely Small Package: At 0.8 mm X 0.8 mm the foot print is 35% smaller than other popular alternatives. With board space being at a premium in smart phones and tablets, these packages offer an ideal space saving solution.
- Uses standard 0.5 mm pitch solder guidelines: The diamond arrangement of the pins give a 0.5mm spacing equivalent which may eliminate the need for a stepped solder stencil.
- Power and Performance Options: The 74AUP1G products operate at very low power with a Vcc range of 0.8 to 3.6V. If more performance or a higher voltage operation is needed, the 74LVC1G family operates from 1.65 to 5.5V.