KEMET – C0G with KONNEKT™ Technology
KEMET is Launching a new series for KONNEKT – C0G with KONNEKT Technology
KEMET’s C0G with KONNEKT™ technology surface mount capacitors are designed for high-efficiency and high-density power applications.
KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multichip solution for high density packaging.
By utilizing KEMET’s robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.
What’s NEW? NEW series C0G with KONNEKT – EIA sizes 1812 & 2220
Features and Benefits
• Extremely high-power density and ripple current capability
• Extremely low equivalent series resistance (ESR)
• Extremely low equivalent series inductance (ESL)
• Capacitance offerings ranging from 0.78 nF – 940 nF
• DC voltage ratings from 50 – 3,000 V
• Operating temperature range of −55°C to +125°C
• No capacitance shift with voltage
• No piezoelectric noise
• High thermal stability
• Surface mountable using standard MLCC reflow profiles
Applications
• Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems
• Data centers
• EV/HEV (drive systems, charging)
• LLC resonant converters
• Switched tank converters
• Wireless charging systems
• Photovoltaic systems
• Power converters
• Inverters
• DC link
• Snubber
