Insight SiP: High Performance Bluetooth / ANT+ NFC / Low Energy Module with MCU and Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on the nRF52832 Chip. Its powerful Cortex™ M4 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. Multiple digital and analogue interfaces give optimum flexibility for sensor integration.
Applications
- Connected sensors for medical devices, healthcare, sport, fitness, industrial …
- IoT applications, connected objects
- Wearable technology
- Home automation
- Beacons
Certification
- Bluetooth SIG certification pending
- Fully CE certified, certification pending
- Fully FCC certified, certification pending
- Fully IC certified, certification pending
- Fully TELEC certified, certification pending
- RoHS compliant
Main Specifications
- Single Mode BLE V4.2
- ANT/ANT+ stack available
- NFC-A Tag for OOB pairing
- Based on Nordic Semiconductor nRF52
- 2.4GHz low energy RF Transceiver
- 32-bit ARM Cortex M4 CPU
- 512 kB Flash & 64 kB SRAM
- 30 GPIOs including ADC, SPI, UART, PDM, I2C
- Ultra small size 8.0 x 8.0 x 1.0 mm
- Fully integrated RF matching and Antenna
- Integrated 32 MHz & 32kHZ Clock
- DC/DC converter with loading circuit
- Operating Conditions
- Supply voltage 1.7 to 3.6 V
- Temperature range -40 to +85°C
- Power Consumption
- Peak current, Rx active 6.1 mA
- Peak current, Tx active 5.4 mA
- Deep sleep current 0.4 µA
- Clock Sources
- Internal HF clock, 32 MHz crystal
- Internal LF clock, 32.768 kHz crystal
- Frequency tolerance +/- 40 ppm
- Radio Specification
- Frequency range 2402-2480 MHz
- Rx sensitivity -96 dBm
- Antenna gain 0.6 dBi
- Range open filed 100 m typ
- Data rate up to 2 Mbps
Product User Guide
- Ordering Information
- ISP1507-AX-ZZ
BLE & ANT protocol, 512 kB flash, 64 kB RAM
- ISP1507-AX-ZZ
- Prototype Packaging (ZZ = ST)
- Delivered in unsealed standard trays
- Please bake the module before assembly
- Jedec Trays
- Delivered in sealed packaging
- MOQ 100 units (ZZ = J1)
- Multiple of 200 units (ZZ = J2)
- Tape & Reels
- Delivered in sealed packaging
- Multiple of 500 units (ZZ = RS)
- Multiple of 2000 units (ZZ = R2)
- Storage
- Electronic sensitive devices
- Moisture Sensitivity
- Level MSL-5
- Bake 24 hours at 125°C if module stored at ambient room
- Soldering Information
- According to Jedec J-STD-020
- Maximum peak temperature
260°C / 30 sec
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