Infineon - TRENCHSTOP™ Advanced Isolation

Infineon – TRENCHSTOP™ Advanced Isolation

Fully isolated TO-247 package with industry leading IGBTs

This new package concept is able to match the highest requirements in terms of performance, design flexibility and ease of handling. By eliminating the need for thermal grease or thermal interface sheets the TRENCHSTOP™ Advanced Isolation is able to deliver at least 35% lower thermal resistivity and at least 10% system cost reduction, helping designers to lower system complexity, development time, and assembling costs.

Within the first wave we are launching four IGBTs with TRENCHSTOP™ HighSpeed 3 technology and one Rapid switching 650 V emitter controlled diode.

Features:

Fully Isolated package
- Plug & Play solution
- 100% isolated
- Viso: 3kV for 1 sec
Best in class R_th(j-h)
- 35% lower R_th(j-h) compared to Iso-foil
- 50% lower R_th(j-h)compared to Full-Paks
Low coupling capacitance
- 38pF
- 36% lower than standard Isolation
- 25% lower than MICA
- Similar to Al₂O₃

Benefits:

Lower assembly costs
- No Need to use Isolation and thermal grease
- 35% reduction in assembling time compared to Standard TO-247 with Iso-foils
Improved reliability
- Increased yield eliminating misalignments of Isolation foils
Decreased heatsink size or increased power density
- Up to 10°C lower Tc compared to Standard TO-247 with Isolation material
- Up to 20% Iout increase for higher power Output
Decreased EMI filter size & decreased System costs
Improved reliability
- Complete manufacturing process Control
- Easy paralleling

Value propositions:

Reliable electrical insulation, good thermal conductivity, low thermal resistance, higher fsw, reduced assembly time, higher assembly yield
Higher reliability alternative to FullPak cost/performance insulation foil (used in MHA) or high Performance Isolation foil or ceramic (used in IND)

Target applications: