Infineon – HybridPack™ Drive Family designed for Hybrid- and Electric Vehicle applications
The HybridPACK™ Drive Family offers 3 variants of power modules for main inverters with a selection of collector current and blocking voltage: 660 A/750 V, 770 A/750 V, 820 A/750 V. Additional variants: 950 A/750 V and 380 A/1200 V, coming in Q3 2019.
Adapted baseplate structure for different cooling types. Flat baseplate without direct cooling structure, Pinfin for best cooling performance and Wave (Ribbon Bond) for a cost efficient solution between low and high performance. One gate driver PCB fits all module variants, keeping the same module footprint.
– 750 V EDT2 IGBT for up to Tvj = 175°C switching operation
– Variety of performances due to different cooling interfaces.
– Mechanical guiding elements and press-fit pins for the signal terminals.
> Automotive applications
> Hybrid electrical vehicles (H)EV
> Motor drives
> Commercial agriculture vehicles
> Benchmark IGBT chip with higher density and lower switching losses.
> Very compact and cost efficient inverter designs
> Reuse of existing package technology
> Broad portfolio of modules for different performance classes
> Support easy assembly processes Product
Quality, production capabilities and modular approach for designIn.
Product collaterals / Online support
– Product family page
– Product brief
– Application note
– Application brochure
Product overview incl. data sheet link
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