ASSMANN WSW presents new „Stamped CPU Heat Sink“
To ensure proper operation and a long life span of electronic components a focus on effective cooling methods is essential.
For cooling devices such as PGA (Pin Grid Array), BGA (Ball Grid Arrays) or other high power components this consideration is a very important issue, because to replace an overheated component can be complicated, cost intensive or nearly impossible.
The traditional “CROSS CUT” and ”PIN FIN” – CPU heat sinks, which over several years have been successfully established at ASSMANN WSW, have now been further improved upon. This results out of innumerable designs, which have been implemented for specific customer requirements.
The new developed series called „Stamped CPU Heat Sinks” from ASSMANN WSW is a combination of “CROSS- CUT” and “Finger-Shaped heat sinks”:
The advantage of this new heat sink design improves air convection up to 5%, because of non-simultaneous heating from one cooling fin to the other. The result is a better heat exchange between the various “hot and cold” air layers. Designated holes in the T=3mm base plate will optimize this exchange as well. These stamped CPU heat sinks are manufactured from “AL5052” aluminum alloy.
Other advantages of these heat sinks, used for cooling many different types of CPU components, are the additional mounting options and countless modification possibilities.
The stamped holes in the base plate can optimally be used to mount the heat sink on the PCB via “Push Pins”. It is also possible to use solder pins to attach the heat sink on the PCB, which cannot be achieved with ordinary heat sink shapes, neither CROSS CUT, nor PIN FIN. Single-or double sided thermal adhesive tape can be used according to your application and can be preinstalled or shipped separately for in-house installation. Custom notches in the heat sink can be attained through modifications of the tool. This offers further possibilities: the cooler can be mounted next to other electronic components, without stressing each other because of space problems and without compromising the overall size of the heat sink.
Other special requirements such as:
- Alternative material thickness
- Modifications of all dimensions and perforations
- special surface Treatments
- alternative custom made heat sink attachment methods
Give us your challenge, which we will gladly accept and realize together with our Partner RUTRONIK
