Integrated fine-pitch circuitry. Molex Incorporated introduces MediSpec™ Moulded Interconnect Device/Laser Direct Structuring (MID/LDS); this 3D technology combines advanced MID...
Offers fixture manufacturers excellent wire-to-holder retention with easy, consistent installation Molex Incorporated announced today that its first SlimRayTM Pre...
Wireless communication specialist Free2move is announcing a new revision of its industrial grade Bluetooth communication module F2M03GXA. Fully certified...
Features of Renesas RZ/A1H The embedded microprocessor RZ/A1H with an ARM® Cortex®-A9 running at up to 400MHz clock speed...
Small footprint, ready-to-use WiFi modules add straight-on connectivity ST’s SPWF01S series of RF-certified Wi-Fi modules is a compact, flexible...
Murata announced that is about to commence mass production of a range of surface-mounted NTC temperature sensors that are...
470 and 476 Series Fuses Improve Design Flexibility in Space-Constrained Applications New 470 and 476 Series NANO2® Subminiature Fuses...
Ultra-low power SL871-S is ideally suited for power-conscious, GPS-based applications and easily swaps with other xL871 series modules for...
The FLA Series Single Phase Film Capacitor uses a metalized polypropylene dielectric and an aluminum case impregnated with soft...
Vishay Intertechnology announces that its PATT precision automotive thin film chip resistor is now available in the 0402 and...
