STMicroelectronics – BALF-ATM-01E3

The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance.

Key Features

  • 2.4 – 2.5 GHz balun with integrated matching network
  • Matching optimized for following chipsets: ATSAMR21E18
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated CSP on glass bumpless
  • Small footprint 2.5 mm²

 

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