PAN1026 – Bluetooth Classic and Low Energy Dual Mode Module
PAN1026 is based on Toshiba´s single chip TC35661 Bluetooth semiconductor device with embedded Toshiba Bluetooth SIG certified stack. It significantly reduces external component count and power consumption in applications requiring support for Bluetooth 2.1 and 4.0 standards. PAN1026 offers a fully embedded SPP Bluetooth classic profile managed via an API Command Set. The Bluetooth 4.0 stack – better known by its key innovation “Bluetooth Low Energy” – is also embedded up to GATT profile and available via an API as well. If favored the device can also be run in a standard Bluetooth HCI mode.
The device allows for serving both legacy Bluetooth classic and Bluetooth Low Energy connections with rapid connection and disconnection, needed by a wide range of applications. The PAN1026 Module is manufactured in a very small 15.6 x 8.7 x 1.9 mm³ SMD package with integrated antenna and shielded case. It’s qualified according to the Bluetooth 2.1 and 4.0 standard and supports industrial temperature range of -40°C to +85°C. The product is FCC/IC and CE qualified.
For testing and development purposes Toshiba is offering a new development platform for Panasonic’s PAN1026 – the BMSKTOPASM369BT. Beside the SPP and GATT profiles, which are already available in the Flash of the PAN1026, Toshiba’s Development Kit offers a wide variety of additional software packets, which run on a TMPM396 CortexM3 MCU equipped with 512 KB Flash and support interfaces such as Ethernet, CAN, USB, serial and UART
- Bluetooth Classic and BLE (Dual Mode) support
- Bluetooth Classic 2.1 embedded SPP profile with high level API commands
- Bluetooth 4.0 (LE) embedded GATT profile with high level API commands, compatible to Toshiba reference BLE profiles
- Operational Temperature Range -40 / 85 degree C
- Dimension 15,6*8,7*1,9mm3
- Internal crystal oscillator (26MHz)
- Integrated shielding to resist EMI
- No external components needed
- High sensitivity (-88 dBm typ.)
- Tx power control up to a maximum of 4.0 dBm (typical)
- Access Points
- Industrial Control
- Wireless Sensors
- Low Power
- Smart Phone
- Sports & Wellness
*** Update September 2015 : Toshiba released a new version of Bluetooth SDK (v2.0.3). Beside numerous improvements and a few bug fixes, the new SW version now officially supports iAP1/iAP2 protocol, implements AltBeacon profile and offers support for Toshiba’s TC35670 (BLE+NFC) chip. Due to the fact that this Panasonic module is affected of this update, you can contact the Rutronik Wireless Team to get further informations about the workflow for the iAP Software Driver, which comes from BlueCreation under MFI licenses.