New RCA-AP e4 Series of Sulfur-Resistant Thick Film Chip Resistors Features AgPd Terminations for Conductive Gluing
The News:
Vishay Intertechnology introduces a new series of sulfur-resistant thick film chip resistors with silver palladium (AgPd) terminations for conductive gluing. Featuring a robust design for automotive and industrial applications, the AEC-Q200-qualified Vishay Draloric RCA-AP e4 series devices provide advanced sulfur resistance and high operating temperatures to +175 °C.
- Feature a unique flip chip design
- Save space with a reduced package footprint compared to solderable devices
- Low parasitic capacitance and inductance
- Sulfur withstand ability in accordance to ASTM B809-95, tested at an advanced
- level of 90 °C for 1,000 hours
Product Benefits:
- Sulfur-resistant
- AgPd terminations for conductive gluing
- AEC-Q200 qualified
- High operating temperatures to +175 °C
- Available in compact 0603 case size
- Power ratings to 0.15 W
- Resistance range from 1 Ω to 10 MΩ
- Tolerance down to ± 1 %
The Key Specifications:
- Case size: 0603
- Power dissipation at +70 °C: 0.15 W
- Resistance: 1 Ω to 10 MΩ
- Tolerance: ± 1 %; ± 5 %
- TCR: ± 100 ppm/K; ± 200 ppm/K
- Operating voltage: 75 V
Market Applications:
Hybrid circuits for automotive and industrial applications in high-temperature environments
To access the product datasheet on the Vishay website, go to http://www.vishay.com/ppg?20062 (RCA-AP e4)
