Infineon – OptiMOS™ power MOSFETs in innovative Source-Down PQFN 3.3×3.3mm package
Infineon introduces a new industry standard packaging concept with Source-Down technology. The silicon die is flipped upside down inside of the component, offering a number of advantages at the device and system level. Instead of the drain pin connected to the PCB over the thermal pad, the source pin is connected to it. Source-Down offers many benefits compared with current solutions like a 30% lower RDS(on), improved thermal performance and optimized layout possibilities. The combination of new benchmark RDS(on) combined with its improved layout capabilities, makes the Source-Down package a true thermal management champion. This new package helps to address many pain-points in a variety of end applications such as Drives, Telecom, SMPS and Servers to name a few. The 25V devices in the 3.3 x 3.3mm Source-Down package are the first products entering the market with a product portfolio ranging from 25V up to 150V that will be fully released within the next two years. This new technology comes in two different footprint versions: the “Source-Down” and the “Source-Down Center-Gate” version, which is optimized for parallelization.
Features:
- RDS(ON) reduction of up to 30% compared to current technology
- Superior thermal management option compared to standard package
- Optimized layout possibilities
- Two footprint versions available
Benefits:
- Highest power density and performance
- Shrink of form factor
- Optimized PCB parasitics
- Decrease of RthJA and RthJC
- Better transfer of power losses
- Supports double side cooling (exposed clip)
- Source Down is easy to adapt on existing PCB
- Center Gate option enables optimized parallelization
- Performance of a Super SO8 in a smaller package
- Higher current capability
Target applications:
- Drives
- Telecom
- SMPS
- Server
- Oring
- Battery protection
Competitive advantage:
- Best in Class RDS(on) in 3×3 package outline
- Lower Rthjc leading to relaxed thermal design in the end application
- Enabling flexible Layout solutions leading to: Better thermal management, form factor shrink
