F&S efusA9 – ARM based Module
Certified for Industry and Automotive
Using efus™A9 guarantees a quick „Time-to-Market“. The efus™ form factor has a size of only 47x62mm. It is equipped with finger-type contacts for common 230 pins MXM-2 edge connectors, which are inexpensive and certified for industry and automotive.
Easy Base Board
efus™A9 was designed by “EasyLayout“ guidelines. EasyLayout describes the concept of no crossing lines or avoidable through holes. This enables an easy base board and good EMC behavior.
Convincing Equipment and Long-Term Availability
The i.MX6 Cortex-A9 CPU has high processing power and excellent multimedia features (3D graphics, 1080p Decoder, H.264 HP, ARMv7™, NEON and VFPv3). Other important features are the long-term availability of up to 15 years and a temperature range of -40°C to +85°C.
The efus™A9 module comes with up to 1GB RAM, 32GB Flash and interfaces like Gigabit-Ethernet, USB Host, USB Device, 2x CAN, 2x I²C, 2x SPI, 4x Serial, GPIOs, 1+1 uSD-Card, I2S, SATA, PCIe and camera. Digital RGB, 2 channel LVDS (up to FullHD, JILI30 compatible) and DVI are offered simultaneously for display connection. A resistive 4-wire, as well as a capacitive touch controller can be connected via the I²C interface.
The circuit board space of efus™A9 can be expanded with wireless modules (Bluetooth, WLAN, ZigBee, Z-Wave, EnOcean) on sideways, without the need to change the layout of the CPU area. We also support our customers in the process of wireless module certification.
Development and Production are located at F&S in Stuttgart/ Germany – optimal conditions for the F&S project guarantee: It is based on single source (hard-, software and production), excellent support and on up to 15 years of availability of every efus™ board.
- Freescale i.MX6 CPU
- up to 15 years availability
- high connectivity due BT, WLAN, ZigBee, Z-Wave, EnOcean
- no seperated baseboard required
- SPI, CAN 2.0, Touchcontroller, USB-Host, USB-Device, SD-Card