Active Cooling for latest Intel® Core™ CPUs

Active Cooling Solution for 12th / 13th / 14th Generation Intel® Core™ processors

Ideal cooling solution for most demanding Intel^® Core^™ processor SKUs

If you are looking for a capable cooling solution for the most powerful latest generation Intel^® Core^™ processors (up to 200 W TDP), this is for you! The LGA1700-based active cooling solution from HSM Zamecki is designed specifically for the most demanding Alder Lake / Raptor Lake (Refresh) processor SKUs. Unlock the full potential of Intel^® Core^™ desktop processors.

Main benefits:

Industrial alternative to water cooling systems
Ideal for high-performance Intel^® Core^™ K and KF processor SKUs
Single cooler solution (no separate cooling required)
Quick & simple installation and mounting

HSM Zamecki now offers an active cooling solution designed for Alder Lake / Raptor Lake processors based on the LGA1700 socket. The 3U active aluminum heatsink with copper base and 4 heat pipes consists of Cooler and Backplate.

Order at R24 Data sheet S3SA‐DSD1‐E121Z Drawing X-backplate

This product can only be purchased from RUTRONIK (Matchcode: S3SA‐DSD1‐E121Z).

Characteristics:

Heatsink Material: Aluminum with copper base and 4 heat pipes
Fastener: Screw & Spring
PWM Fan: F129025BUAF4Q8aR with two ball bearing
Fan Speed: 800 – 3450 rpm, Air Flow: 16.29 – 70.24 CFM, Noise Level: 21 – 43 dB-A
Dimensions (L x W x H): 95 x 92 x 103 [mm]
Weight: 457 g
Thermal Material: X23-7762
Thermal Resistance: 0.152 °C/W
RoHS & REACh compliant
Made in PRC