Vishay IGBR Series – HIGH POWER, BACK-CONTACT, THIN FILM RESISTOR
HIGH POWER BACK-CONTACT THIN FILM RESISTOR
WIRE BONDABLE SILICON CHIP RESISTOR
APPLICATIONS
- Gate resistor for silicon carbide MOSFET
and IGBT-based power converters - Current limiting for LED lighting
- High power
- Alternative energy
- Hybrid assemblies
KEY FEATURES
- Sintering, soldering, and epoxy attachment
method options - Low inductance
- Only one wire bond required – up to
6 mils diameter - Moisture-resistant
- Small size, high power density
The Benefits of Using a Thin Film, High Power, Back-Contact Resistor |
The high power back-contact resistor (IGBR) series thin film chip resistor utilizes the excellent thermal properties of
silicon to allow ultra high power rating with miniature case size for hybrid (chip and wire) assemblies.
The IGBR requires only one wire bond thus saving hybrid space.
The IGBRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology.
The IGBRs are 100 % electrically tested and visually inspected to MIL-STD-883, method 2032 class H, class K, mrcial inspection per internal standards.