Samsung Semiconductors COBs – available in a range from 6 – 40 Watt devices
- Chip on Board (COB) solution makes it easy to design in
- Efficient LES area over product size
- Uniform chip arrangement & light distribution over LED
- Concave chaped corner for Screw fixation
- Simple assembly reduces manufacturing cost
- InGaN/GaN MQW LED with long time reliability
- Completed 6,000 hours of LM-80 testing @ 180 mA (6 W) , 240 mA (8 W), 360mA (13 W), 540mA (19 W) , 720 mA (26 W), 900 mA (33 W), 1080mA (40W) 105 ℃ . LES: 8 mm (6+8 W), 11 mm (13 W), 12,4mm (19 W), 17mm (26 + 33+40W) . Footprint: 13.5 mm x 13.5 mm (6+8W), 17.0 mm x 17.0 mm(13+19W), 21.5 mm x 21.5 mm (26+33+40W)
- Constant Performance Improvement: In-house chip and phosphor technology enable to improve Performance.
- Good reliability for a long life time: high thermal conductive metal substrate (Aluminum alloy) deliver the low thermal resistance (0.8 ~ 1.2℃/W)
- Good Color Consistency of MacAdam 3
- Easy and Safe Assembly Work
Samples are avialable in several Wattages and colour temperatures.