KEMET KC-LINK with KONNEKT Technology Extensions

KEMET’s C0G with KONNEKT™ technology surface mount capacitors are designed for high-efficiency and high-density power applications.
KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multichip solution for high density packaging.

By utilizing KEMET’s robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

What’s New?

KEMET has recently launched some new partnumbers from the KC-LINK with KONNEKT Technology series.

Adding 3-chip KONNEKT to 1812 case size
Adding 3 and 4-chip KONNEKT to 2220 case size

In detail:

part-number	Description	Cap.-value	Tol.	Voltage	Ceramic	Temp.-Range		Size	Orientation	nr. of Chips
CKC18C144KWGLCAUTO7805	KC-LINK with KONNEKT Technology 1812 140nF 650VDC C0G Standard Low Loss	140nF	±10%	650	C0G	-55	+150	1812	Low Loss	3
CKC18C453KDGLCAUTO7805	KC-LINK with KONNEKT Technology 1812 45nF 1000VDC C0G Standard Low Loss	45nF	±10%	1000	C0G	-55	+150	1812	Low Loss	3
CKC21C104KDGLC7805	KC-LINK with KONNEKT Technology 2220 0.1µF 1000VDC C0G Standard Low Loss	0.1µF	±10%	1000	C0G	-55	+150	2220	Low Loss	3
CKC21C273KJGLCAUTO7805	KC-LINK with KONNEKT Technology 2220 27nF 1700VDC C0G Standard Low Loss	27nF	±10%	1700	C0G	-55	+150	2220	Low Loss	4