Infineon – Eco Block – Solder Bond Technology

Infineon – Eco Block – Solder Bond Technology

TT240N16SOFHPSA1, TD240N16SOFHPSA1, TT240N18SOFHPSA1, TD240N18SOFHPSA1, DD220N16SHPSA1

Infineon Technologies Bipolar extends its product portfolio of thyristor / diode modules in solder bond technology with higher current ratings. The 34 mm Eco Block modules cover now current ratings from 140 A to 240 A. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must.

Features
– Optimized thermal design
– Industrial standard package
– Electrically insulated base plate

Technology comparison

Competitive advantage
– Robust mechanical design
– Highest power density in the market

Benefits
– Increased power density
– Predictably high performance and lifetime due to 100% x-ray monitoring
– Solid base plate for fast and easy mounting
– Optimized for less performant heat sinks

Target applications
– Drives
– Welding
– UPS

Products collaterals / Online support
– Product family page
– Selection guide
– Simulation tool (Simulate IGBT modules for your inverter/DC converter applications; calculate switching and conduction losses for all components, counting in conduction/switching losses and thermal ratings; results are shown in tabular and graphic presentation and can be saved for later revision or printed as .pdf file)

Completing products

62mm IGBT Modules

Block diagrams

Product overview incl. data sheet link