ATP DRAM modules – Ensuring reliability under intense workloads
ATP DRAM solutions offer outstanding reliability, long-term stability and intense performance in industrial environments. At Rutronik24 significant quantities of ATP DDR4 modules are available from stock.
Reliability Solutions and Technologies of ATP DRAM modules
Every Dynamic Random Access Memory (DRAM) module is equipped with memory chips made up of numerous tiny integrated circuits (ICs). These ICs are expected to offer outstanding reliability and long-term stability under intense workloads and demanding conditions. Whether at rest or in operation, DRAM modules face hazards throughout their entire life cycle, and any malfunction can cause system breakdowns that lead to disrupted or delayed business operations. Hence, these components should be manufactured and packaged in accordance with very high standards and should be used appropriately to avoid or minimize known risks.
DRAM modules for the corporate and industrial applications are typically installed in high-performance environments like data centers. Here, uninterrupted data processing is performed on a large scale and any downtime can severely impact the business. Another common field of application for DRAM modules is the usage in industrial systems. Often these systems are situated in remote places difficult to reach for regular maintenance. It is therefore important to secure long-term stability and reliability of the DRAM modules.
To ensure maximum reliability DRAM modules from ATP have to pass two levels of testing:
- Advanced IC-Level Testing screens: ICs with the best reliability and quality characteristics that are suitable for applications requiring wide temperature ranges.
- Enhanced Module-Level Tests: Test During Burn-In (TDBI) and Automatic Tests vary parameters like supply voltage to guarantee tolerances in later operation on module level.
ATP has over 25 years of expertise in manufacturing industrial-grade memory and storage products best suited for your industrial and embedded requirements. Visit the ATP blog website for more information on ATP’s stringent tests and approaches to ensure DRAM reliability.
ATP DRAM Special Features:
- Conformal coating → Coating film layer protects electronic circuits and modules against dust, moisture, corrosion, chemicals, and extreme temperatures.
- Corrosive sulfur protection → Anti-sulfur resistors reject the damaging effects of sulfur contamination to prevent unnecessary downtime and expensive component replacements.
- Thicker Gold Finger Plating with 30µ” thickness & board consisting of 6-10 layers of PCB Assemblies (PCBA) → Better signal quality as well as mechanical module reliability and durability.
- Industrial temperature rating → Ensuring long-term stability, availability and steady performance in industrial applications (Optional: enduring extreme temperatures ranging from -40°C to 95°C)
ATP DRAM modules available at Rutronik24
DDR4 modules
DDR4 – Specifications |
||||||||
DIMM Type |
RDIMM |
ECC UDIMM |
Non-ECC UDIMM |
ECC SO-DIMM |
Non-ECC SO-DIMM |
Mini-RDIMM |
Mini-UDIMM |
|
Density |
4 GB to 128 GB |
4 GB to 32 GB |
2 GB to 32 GB |
4 GB to 32 GB |
2 GB to 32 GB |
4 GB to 16 GB |
4 GB to 16 GB |
|
Speed up to (MT/s) |
3200 |
3200 |
3200 |
3200 |
3200 |
2400 |
2400 |
|
PCB Height* |
Low profile / VLP / ULP |
Low profile / VLP / ULP |
Low profile / VLP / ULP |
Low profile |
Low profile |
Low profile / VLP / ULP |
Low profile / VLP / ULP |
|
Operating Temperature |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
|
* VLP: 0.74″, ULP: 0.7″
DDR3 modules
DDR3 – Specifications |
||||||||
DIMM Type |
RDIMM |
ECC UDIMM |
Non-ECC UDIMM |
ECC SO-DIMM |
Non-ECC SO-DIMM |
Mini-RDIMM |
Mini-UDIMM |
|
Density |
1 GB to 32 GB |
1 GB to 16 GB |
1 GB to 16 GB |
1 GB to 16 GB |
1 GB to 16 GB |
1 GB to 16 GB |
1 GB to 16 GB |
|
Speed up to (MT/s) |
1866 |
1866 |
1866 |
1866 |
1866 |
1600 |
1600 |
|
PCB Height* |
Low profile / VLP / ULP |
Low profile / VLP / ULP |
Low profile / VLP / ULP |
Low profile |
Low profile |
Low profile / VLP / ULP |
Low profile / VLP / ULP |
|
Operating Temperature |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
0°C to 85°C / -40°C to 95°C |
|
* VLP: 0.74″, ULP: 0.72″
(Source: ATP Electronics)