Infineon – Prime Block – Solder Bond Technology

Infineon – Prime Block – Solder Bond Technology

TT390N16SOFHPSA1, TD390N16SOFHPSA1, TT390N18SOFHPSA1, TD390N18SOFHPSA1, DD390N16SHPSA1, DD390N22SHPSA1

Infineon Technologies Bipolar extends its product portfolio of thyristor /diode modules in solder bond technology with higher current ratings. The 50 mm Prime Block modules cover now current ratings of 390 A and become best in class. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must.

Features
– Optimized thermal design
– Best in class current rating in 50 mm foot print
– 50 mm foot print available with TIM

Technology comparison

Completing products
62 mm IGBT Modules

Benefits
– Increased power density
– Predictably high performance and lifetime due to 100% x-ray monitoring
– Solid base plate for fast and easy mounting
– Optimized for less performant heat sinks

Competitive advantage
– Robust mechanical design
– Highest power density in the market

Target applications
– Drives
– Welding
– UPS

Products collaterals / Online support
– Product family page
– Selection guide
– Simulation tool (Simulate IGBT modules for your inverter/DC converter applications; calculate switching and conduction losses for all components, counting in conduction/switching losses and thermal ratings; results are shown in tabular and graphic presentation and can be saved for later revision or printed as .pdf file)

Block diagrams

Product overview incl. data sheet link