DFI MTH966 COMe Compact (Type 6) – High‑Performance Edge AI Module
DFI MTH966 COM Express Compact (Type 6): High‑Performance Edge AI Module Powered by Intel® Core™ Ultra Processors.
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As edge AI accelerates across industrial automation, robotics, smart manufacturing, and intelligent transportation, system designers need compute modules that combine high CPU/GPU performance, rich I/O, and long‑term industrial reliability. DFI answers this demand with the MTH966, a COM Express Compact Type 6 module built on Intel’s latest Core™ Ultra (Meteor Lake) architecture. With advanced AI acceleration, high‑bandwidth interfaces, and rugged design options, the MTH966 is tailored for next‑generation embedded computing platforms. |
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DFI MTH966 COM Express Compact (Type 6)
Built on Intel® Core™ Ultra for AI at the Edge
At the heart of the MTH966 lies Intel’s Core™ Ultra U‑ and H‑series processors, bringing together a hybrid CPU architecture, Intel® Arc™ graphics (for H‑SKUs), and the new Intel® AI Boost NPU. This provides the module with the performance required for compute‑intensive and AI‑driven applications.
Key CPU capabilities include:
- Support for Intel® Core™ Ultra 7 and Ultra 5 Meteor Lake processors
- Up to 32GB dual‑channel LPDDR5 running at 7467 MHz for high memory bandwidth
- Integrated Intel® Arc™ GPU (H‑series) or Intel® Graphics (U‑series) with support for DirectX 12, OpenGL 4.6, Vulkan 1.2
- On‑chip AI NPU delivering up to 32 TOPS
This combination of CPU, GPU, and NPU ensures the MTH966 can handle workloads such as video analytics, machine vision, robotics orchestration, and predictive maintenance.
Multi‑Display Capability and High‑Definition Graphics
The MTH966 offers versatile display outputs, supporting both embedded and high‑resolution displays:
- 1× LVDS or eDP
- 3× DDI (DisplayPort/HDMI)
- Up to 4K resolution across multiple displays simultaneously
This makes it ideal for HMI panels, medical imaging terminals, AI kiosks, digital signage players, and industrial visualization systems.
Wide I/O and High‑Speed Expansion
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Despite its compact 95 × 95 mm COM Express footprint, the MTH966 provides an exceptional variety of expansion options: PCIe Expansion
USB & Storage
Networking & Connectivity
This level of connectivity allows system designers to integrate multiple sensors, accelerators, and peripherals, making the module ideal for modular, high‑performance edge systems. |
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Industrial Reliability and Temperature Options
DFI offers the MTH966 in SKUs tailored to different deployment environments:
- 0 °C to +60 °C operating range (H‑series SKUs)
- ‑40 °C to +85 °C extended temp (U‑series SKUs)
- 10 – 90% RH humidity tolerance
This ensures reliability in harsh conditions such as factory floors, outdoor installations, and transportation systems.
The module is certified to CE, FCC, and RoHS, ensuring compliance and long‑term availability for industrial OEMs.
Target Applications
Thanks to its AI acceleration and rich I/O, the MTH966 is ideal for:
- Industrial automation & machine vision
- Autonomous mobile robots (AMRs)
- Medical imaging devices
- Smart transportation systems
- AI‑powered HMI & kiosks
- Video analytics and surveillance
- Edge servers and gateways
Its COM Express Type 6 interface allows designers to upgrade compute performance while reusing existing carrier boards.
Conclusion
The DFI MTH966 combines cutting‑edge Intel® Core™ Ultra computing with rugged industrial design, extensive high‑speed I/O, and powerful AI acceleration. For engineers building next‑generation embedded systems requiring reliability, strong compute capabilities, and multi‑display support, the MTH966 stands out as a future‑ready solution.
Explore the full specifications at DFI’s product page or contact Rutronik for assistance with carrier‑board selection, design support, and evaluation samples.
