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STMicroelectronics: Further miniaturization achieved for EEPROMs with the 1.4 mm x 1.7 mm UFDFPN5 package

, , Non-volatile memory, Semiconductors, 0

Ideal for building ultra-small, lightweight applications, the low-profile UFDFPN5 package (also known as MLP5) simplifies manufacturing thanks to its...

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