Infineon – CoolSiC™ hybrid modules – EasyPACK™ power modules with CoolSiC™ Schottky diode

Infineon – CoolSiC™ hybrid modules – EasyPACK™ power modules with CoolSiC™ Schottky diode

CoolSiC™ hybrid modules – EasyPACK™ power modules with CoolSiC™ Schottky diode

The combination of a Silicon-based switch and a CoolSiC™ schottky diode is called a “hybrid solution”. The CoolSiC™ hybrid modules form the ideal bridge between purely Silicon-based and Silicon Carbide solutions. They combine IGBT chips with SiC diodes to further extend the capacity of the IGBT technology. The hybrid modules in the well-known EasyPACK™ come in booster as well as 3-level configuration. The portfolio consists of power modules where SiC diodes and IGBT chips form an ideal pair leveraging the best available performance in the targeted applications, such as solar energy systems. Compared to Silicon IGBT solutions, the turn-on losses can be reduced. In addition higher switching frequency and higher current handling capability can be realized.

Features
– TRENCHSTOP™ 5 H5 or High Speed IGBT H3 and CoolSiC™ Schottky diode
– EasyPACK™ 1B, 2B housing
– Booster or 3-level configuration
– Reduced EMI
– Available with pre-applied Thermal Interface Material (TIM)

Benefits
– Reduction of IGBT turn-on losses
– Optimized development cycle time and cost
– Configuration flexibility
– System efficiency improvement
– Reduced cooling requirements
– Enables higher frequency to increase power density
– Switching loss independent from load current, switching speed

Competitive advantage
Extensive product portfolio to target the whole range of solar inverter power class rating while using latest TRENCHSTOP™ 5 technology

Target applications
– Solar Energy Systems
– UPS

Application diagram – PV/Solar

Product overview incl. data sheet link/ User manual

Product collaterals / Online support
– Product family page
– Simulation tool
– Community

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