ST - MDmesh™ M6 in TO-LL package

ST – MDmesh™ M6 in TO-LL package

The new MDmesh™ M6 technology incorporates the most recent advancements to the well-known and consolidated MDmesh family of SJ MOSFETs. STMicroelectronics builds on the previous generation of MDmesh devices through its new M6 technology, which combines excellent R_DS(on) per area improvement with one of the most effective switching behaviors available, as well as a user-friendly experience for maximum end-application efficiency. The new TO-Leadless (TO-LL) package is space-saving and allows efficient thermal management. Thanks to the additional Kelvin-source lead, designers can achieve better efficiency due to reduced turn-on / turn-off switching losses.

Features:

Reduced switching losses
Lower R_DS(on) per area vs previous generation
Low gate input resistance
100% avalanche tested
Zener-protected
High-creepage package
Excellent switching performance thanks to the extra driving source pin

Package Features:

Reduced space on board
Distributed heat sinks
Additional Kelvin source
Reduced thickness (2.3mm)
High creepage (distance 2.7mm)

The TO-Leadless (TO-LL) package solution was tested against the TO-247 in the PFC and LLC sections of a 1.5 kW SMPS to compare their respective thermal performance and efficiency. The additional Kelvin-source lead generates significant efficiency gains in the PFC section at full load with high current levels, thanks to the reduction of the inductive effect on the turn-on commutation. The efficiency in the LLC section remains identical for both packages.